Asia Pacific expected to be the leading market for FPGA

Xilinx's Virtex® UltraScale+TM VU19P FPGA

Source: Internet, MarketWatch, Xilinx, Microchip, Microsemi, NASA

The FPGA (field-programmable gate array) is an integrated circuit designed to be configured by a customer or a designer after manufacturing, which has been used in wide sectors include telecommunication, aerospace, automotive, defense, financial, high-performance computing, medical, IoT (internet of things), industrial, machine-to-machine (M2M), security, wireless communications, and etc. From 2020 to 2025, the FPGA market will have a high CAGR in the Asia Pacific (APAC), especially, the flash-based FPGA will be expected a new growth opportunity in that region, according to a report by MarketsandMarkets.

MicroChip's RT PolarFire® Radiation-Tolerant FPGAs with NASA's images

The FPGA market is roughly divided into two sectors: flash-based logic arrays and SRAM-based FPGAs. The SRAM-based FPGAs are built with static RAM memory cells., but require external non-volatile memory to hold their configuration pattern, which upon power-up is transferred via serial link into the SRAM-based device. The Flash-based ones only use nonvolatile memory cells, which doesn't require power-up to hold the data. In the past, the flash-based FPGAs trailed behind the SRAM-based devices in density, performance, and on-chip IP such as processor cores, high-speed I/O channels, and other functions requiring high density.
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The key players of FPGA include Xilinx, Inc. (US); Intel Corporation (US), Microchip Technology Inc. (US); Lattice Semiconductor Corporation (US); QuickLogic Corporation (US); Efinix, Inc. (US); Flex Logic Technologies, Inc. (US); GOWIN Semiconductor Corp. (China); Achronix Semiconductor Corporation (US); S2C, Inc. (US); Leaflabs, LLC (US); Adlec, Inc. (US); BitSim AB (Sweden); ByteSnap Design (UK); Enclustra GmbH (Switzerland); EnSilica (US); Gidel (US); Nuvation Engineering (US); Selexica, Inc. (Germany); and EmuPro Consulting Private Limited (India).